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Electronic Packaging and Soldering Technologies

Electronic Packaging and Soldering Technologies

41 faculty research Electronic Packaging and Soldering Technologies on GradNova.

D

Kamel Salama Endowed Professor of Mechanical & Aerospace Engineering; Assistant Vice President of Entrepreneurship and Startup Ecosystem

Department of Mechanical and Aerospace Engineering

University of Houston

J

ing., Ph.D., Professeur titulaire, Co-titulaire de la Chaire CRSNG-IBM Canada sur l'encapsulation innovante de puces microélectroniques

Département de génie mécanique

Université de Sherbrooke

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