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Electronic Packaging and Soldering Technologies Research Faculty | GradNova

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Electronic Packaging and Soldering Technologies

Electronic Packaging and Soldering Technologies

5 faculty research Electronic Packaging and Soldering Technologies on GradNova.

J

Professor

Computer Science

University of California, Davis

3D IC and Tsv Technologies

Cancer Survivorship and Care

Copper Interconnects and Reliability

Electronic Packaging and Soldering Technologies

+1

S

Professor

Computer Science

Portland State University

3D IC and Tsv Technologies

Electrocatalysts for Energy Conversion

Electronic Packaging and Soldering Technologies

Fuel Cells and Related Materials

+1

M

Marco Gerini-Romagnoli

Assistant Professor

Computer Science

Oakland University

Electronic Packaging and Soldering Technologies

Fatigue and Fracture Mechanics

Mechanical Behavior of Composites

Optical Measurement and Interference Techniques

+1

S

Subramaniam Ganesan

Professor

Computer Science

Oakland University

Electronic Packaging and Soldering Technologies

Embedded Systems Design Techniques

Parallel Computing and Optimization Techniques

Real-Time Simulation and Control Systems

+1

H

Hafiz Munsub Ali

Lecturer

Computer Science

Binghamton University

Combinatorial Optimization

Healthcare Informatics

Information Diffusion in Social Networks

Network Planning

+5