Electronic Packaging and Soldering Technologies

41 faculty research Electronic Packaging and Soldering Technologies on GradNova.

Jeffrey Suhling

Quina Distinguished Professor

Department of Mechanical Engineering

Auburn University

Advanced and Composite Materials

Computational Mechanics

Continuum Modeling

Electronic Packaging

+11

Pradeep Lall

John and Anne MacFarlane Endowed Distinguished Professor and Alumni Professor Director, Auburn University Electronics Packaging Research Institute Director, Alabama Node of NextFlex

Department of Mechanical Engineering

Auburn University

Additive Printed Electronics

Electronics Manufacturing

Electronics Reliability

Flexible Hybrid Electronics

+11

George Flowers

Department Chair Dan H. Arnold Jr. Distinguished Professor

Department of Mechanical Engineering

Auburn University

Dynamics of Rotating Machinery

Vibration Analysis of Electronic Systems

Electrical Contact Performance and Analysis

Magnetic Bearings and Levitation Dynamics

Ke Zeng, Ph.D.

Assistant Professor

Department of Electrical and Computer Engineering

University of North Carolina at Charlotte

Electronic Packaging and Soldering Technologies

Ga2o3 and Related Materials

GAN-Based Semiconductor Devices and Materials

Intermetallics and Advanced Alloy Properties

Reza Ghodssi

Distinguished University Professor

Department of Electrical and Computer Engineering

University of Maryland, College Park

Advanced Battery Technologies Research

Advanced Surface Polishing Techniques

Electric and Hybrid Vehicle Technologies

Electronic Packaging and Soldering Technologies

Janet Lumpp

Professor; Electrical Engineering

Department of Electrical and Computer Engineering

University of Kentucky

Carbon Nanotubes in Composites

Electronic Packaging and Soldering Technologies

Engineering Education and Pedagogy

Experimental Learning in Engineering

Eric Bogatin

Scholar In Residence

Department of Electrical, Computer and Energy Engineering

University of Colorado Boulder

3D IC and Tsv Technologies

Electromagnetic Compatibility and Noise Suppression

Electronic Packaging and Soldering Technologies

Microwave and Dielectric Measurement Techniques

Christopher Palmstrøm

Distinguished Professor

Department of Electrical and Computer Engineering

University of California, Santa Barbara

Dissimilar Materials Epitaxial Growth

Materials for Quantum Information Systems

Metallization of Semiconductors

Molecular Beam and Chemical Beam Epitaxial Growth of Metallic Compounds, Heusler Compounds, Functional Materials, Magnetic Materials and Compound Semiconductors

Boris Vaisband

Assistant Professor of Electrical Engineering and Computer Science

Department of Electrical Engineering and Computer Science

University of California, Irvine

And Design and Optimization Methodologies, Including Power Delivery and Thermal Management, Communication, and Floorplanning

Heterogeneous Integration and Advanced Packaging

Neuromorphic Circuits and Systems

3D IC and TSV Technologies

Linda Katehi

Professor, Electrical & Computer Engineering and Materials Science & Engineering; O'Donnell Foundation Chair II; Member, National Academy of Engineering

Department of Electrical and Computer Engineering

Texas A&M University

3D IC and Tsv Technologies

Advanced Memory and Neural Computing

Electronic Packaging and Soldering Technologies

Ferroelectric and Negative Capacitance Devices

Douglas C. Hopkins

Research Professor, Dir. PREES Lab

Department of Electrical and Computer Engineering

North Carolina State University

3D IC and Tsv Technologies

Advanced Dc-Dc Converters