GradNova

3D IC and TSV Technologies

5 faculty research 3D IC and TSV Technologies on GradNova.

S

Associate Professor

Computer Science

University of California, Berkeley

Computer Architecture & Engineering (arc)

Cyber-Physical Systems and Design Automation (cpsda)

Integrated Circuits (inc)

Embedded Systems Design Techniques

+2

S

Professor

Computer Science

Tufts University

Computer-Aided Design for Integrated Circuits

Machine Learning for Systems Biology

Metabolic Engineering

Microbial Metabolic Engineering and Bioproduction

+4

T

Tasnuva Farheen

Assistant Professor

Computer Science

Louisiana State University

Enabled Security Assessment

Hardware Security

Microelectronics Security & Reliability Assurance

Quantum Computing

+5

P

William J. Brown Professor

Computer Science

Carnegie Mellon University

Atrial Fibrillation Management and Outcomes

3D Printing in Biomedical Research

Cellular Mechanics and Interactions

Microfluidic and Bio-Sensing Technologies

+2

H

Hafiz Munsub Ali

Lecturer

Computer Science

Binghamton University

Combinatorial Optimization

Healthcare Informatics

Information Diffusion in Social Networks

Network Planning

+5