Home
/
Research
/

3D IC and Tsv Technologies

3D IC and Tsv Technologies

26 faculty research 3D IC and Tsv Technologies on GradNova.

J

ing., Ph.D., Professeur titulaire, Co-titulaire de la Chaire CRSNG-IBM Canada sur l'encapsulation innovante de puces microélectroniques

Département de génie mécanique

Université de Sherbrooke

R

Senior Vice Chancellor Board Appointment/Officer, Senior Vice Chancellor for Research; Professor of Computer Science and Electrical and Computer Engineering

Department of Electrical and Computer Engineering

University of Pittsburgh

2
Next