GradNova

Heterogeneous Integration and Advanced Packaging

1 faculty research Heterogeneous Integration and Advanced Packaging on GradNova.

B

Assistant Professor of Electrical Engineering and Computer Science

Department of Electrical Engineering and Computer Science

University of California, Irvine

And Design and Optimization Methodologies, Including Power Delivery and Thermal Management, Communication, and Floorplanning

Heterogeneous Integration and Advanced Packaging

Neuromorphic Circuits and Systems

3D IC and TSV Technologies

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