GradNova

High-Speed Inter- and Intra-Chip Interconnect

1 faculty research High-Speed Inter- and Intra-Chip Interconnect on GradNova.

H

Professor of Electrical and Computer Engineering

Department of Electrical and Computer Engineering

University of Rochester

Electronic-Photonic Integrated Circuits and Systems

High-Performance Clocking in Microprocessors and Socs

High-Speed Electronics

High-Speed Inter- and Intra-Chip Interconnect

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