GradNova

Electronic Cooling of "chips" for High Performance Computing (hpc)

1 faculty research Electronic Cooling of "chips" for High Performance Computing (hpc) on GradNova.

A

Professor, Mechanical and Aerospace Engineering

Department of Mechanical and Aerospace Engineering

Michigan Technological University

Boiling and Condensing Flows

Electronic Cooling of "chips" for High Performance Computing (hpc)

Enhanced Nucleate Boiling (enb) in Innovative Heat Exchangers With Specialized Flow Loop With Flow Control

Experiments, Modeling, Cfd/cht

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